Fineceratech's Aluminum Nitride (AlN) Ceramic Dome Covers are designed for applications that require exceptional thermal management and electrical insulation. With its excellent thermal conductivity and superior electrical insulating properties, AlN is a premium ceramic material widely used in advanced electronics, optoelectronics, and high-temperature systems. The dome-shaped design of these covers provides enhanced protection and heat dissipation for sensitive components.
- AlN ceramic provides outstanding thermal conductivity, up to 170 W/mK, ensuring efficient heat dissipation in high-power electronic devices and high-temperature environments.
- Despite its high thermal conductivity, AlN offers excellent electrical insulation, making it ideal for applications where electrical isolation and thermal management are required.
- Capable of withstanding temperatures up to 1000°C, AlN dome covers maintain their integrity and performance in extreme temperature conditions, ensuring reliable protection for sensitive components.
- The low coefficient of thermal expansion closely matches that of silicon, reducing thermal stress and enhancing the longevity and reliability of electronic and optoelectronic components.
- AlN is chemically stable and resistant to most corrosive agents, providing durability and longevity in harsh chemical environments.
- Fineceratech's AlN ceramic dome covers are manufactured with high precision, ensuring a perfect fit and optimal performance in various applications.
- The dome shape allows for even heat distribution and provides mechanical strength, making it suitable for encapsulating and protecting delicate components from mechanical and thermal stress.
- Ideal for use in high-power electronic devices as protective covers, aiding in heat dissipation and ensuring the stability of critical components.
- Used in the semiconductor industry to protect and manage thermal loads in wafer processing equipment and other sensitive devices.
- Suitable for use in optoelectronic applications, including LED and laser diode packaging, where efficient thermal management is crucial for device performance.
- Applicable in microwave and RF communication systems, providing thermal management while maintaining electrical insulation.
- Utilized in various thermal management systems, serving as protective covers that contribute to effective heat dissipation and component protection.
- Suitable for automotive electronics where high thermal loads and mechanical protection are necessary, such as in power modules and sensors.
- Density: 3.26 g/cm³
- Thermal Conductivity: Up to 170 W/mK
- Dielectric Strength: >10 kV/mm
- Coefficient of Thermal Expansion: 4.5 x 10⁻⁶/K
- Operating Temperature Range: Up to 1000°C
- Chemical Resistance: Resistant to most acids and alkalis
- Electrical Resistivity: >10¹⁴ Ω·cm at room temperature
- Dimensions: Customizable to meet specific application requirements
- Design: Dome-shaped for enhanced mechanical strength and heat distribution
- Reliable Electrical Isolation: Excellent dielectric properties provide reliable electrical insulation, crucial for high-power electronic and optoelectronic applications.
- Enhanced Component Protection: The dome design offers mechanical strength and protection against thermal and mechanical stress, ensuring the longevity of encapsulated components.
- Durability in Extreme Conditions: High thermal stability and chemical resistance provide reliable performance in demanding environments, reducing maintenance and replacement costs.
- Customizable Design: Fineceratech offers customization options to meet specific application requirements, ensuring the optimal fit and performance of AlN dome covers.